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Basler daA4200-30mci machine vision camera
BaslerArea scan cameras
  • Rosepetal compatible
  • Recommended by AIS Vision

Basler dart daA4200-30mci (BCON for MIPI)

daA4200-30mci

The Basler daA4200-30mci is a dart E embedded camera module that uses the BCON for MIPI interface (MIPI CSI-2) and an onsemi AR1335 1/3.2-inch rolling-shutter color CMOS sensor. It provides 4208 x 3120 (13 MP) resolution at 30 fps with 1.1 um pixels and integrated on-camera image processing (ISP) functions such as exposure control, gain, white balance and color creation. Powered at 5 VDC (typ. 1.35 W) it is available as a bare board (5.3 x 27 x 27 mm) or with an S-mount lens holder, targeting space-constrained embedded vision designs.

Brand
Basler
Camera type
Embedded (dart E, area scan)
Interface
bcon-mipi (BCON for MIPI / MIPI CSI-2)
Resolution
13 MP
Horizontal resolution
4208 x 3120 px
Mono / color
Color
Sensor manufacturer
onsemi
Sensor model
onsemi AR1335
Shutter
Rolling shutter
FPS
30 fps
Mount
S-mount or bare board (no mount)
Sensor size
1/3" (4.63 mm x 3.43 mm)
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Technical overview

The Basler dart daA4200-30mci is an embedded camera module rather than a housed industrial camera, and that framing governs every design decision around it. It pairs an onsemi AR1335 1/3.2-inch color CMOS sensor with the BCON for MIPI interface (MIPI CSI-2), delivering the sensor's native 4208 x 3120 pixels (13 MP) at 30 fps. The 1.1 um pixels on a 4.63 x 3.43 mm optical format produce very high spatial sampling from a physically tiny sensor, which is exactly what you want when you need crisp detail but have almost no room: the board itself is just 5.3 x 27 x 27 mm and weighs 5 g. Because it is interface-powered at 5 VDC and draws only 1.35 W typical, there is no separate power harness to route, only the MIPI CSI-2 ribbon to a host carrier board (typically an NXP i.MX or NVIDIA Jetson class processor that exposes CSI-2 lanes).

The sensor is a rolling-shutter device, and that is the single most important behavioral trait to plan around. Rolling shutter exposes the frame row by row, so anything moving quickly through the field of view, or any short LED strobe that does not span the full readout, can introduce skew or partial-frame artifacts. This camera is therefore best aimed at scenes that are static at capture time or that move slowly and predictably: a part indexed and stopped under the optic, a web inspected with continuous illumination, or a handheld/embedded device imaging a settled subject. The 13 MP resolution is the camera's headline strength, giving an installer a large pixel budget to resolve fine text, small defects, or dense 2D codes, but only if the optics and lighting are matched to the small pixel pitch.

On-camera image processing is integrated into the module, so exposure control, gain, white balance and color creation (debayering) happen on the device and are exposed through a GenICam interface over BCON for MIPI. That offloads pipeline work from the host and gives a standards-based configuration model familiar from other Basler cameras. The module ships either as a bare board with no mount or with an S-mount (M12) lens holder, so lens selection is constrained to the compact S-mount ecosystem; you size the focal length to the small 1/3.2-inch format and demanding 1.1 um pixels, favoring lenses rated for high-resolution, small-format sensors. Operating temperature spans 0 to 75 C, which is generous for an embedded board but still requires attention to host-side thermal coupling since the camera shares an enclosure with the processor.

Best for

  • Space- and weight-constrained embedded vision designs (handheld, robotic end-of-arm, or in-device imaging) where the 5.3 x 27 x 27 mm board and 5 g weight matter more than a housed enclosure
  • High-resolution still-image capture of indexed or stationary parts, using the full 4208 x 3120 (13 MP) frame to resolve fine detail for defect inspection
  • Reading printed text and 2D/DPM codes (OCR/OCV and traceability) on settled subjects, where 13 MP gives ample pixels-per-feature for small marks
  • Color inspection tasks that benefit from on-camera white balance and color creation, such as electronics or packaging verification under continuous lighting
  • Designs built on a host processor with native MIPI CSI-2 lanes (e.g., Jetson- or i.MX-class carrier boards) that can consume a GenICam BCON for MIPI stream

Selection notes

  • This is an embedded module on BCON for MIPI (MIPI CSI-2), not a plug-and-play GigE/USB3 camera. You must have a host carrier board that exposes CSI-2 lanes and a driver stack for the BCON for MIPI / GenICam pipeline before this camera is usable.
  • The rolling shutter rules out crisp imaging of fast continuous motion and full-frame short strobing without artifacts. For freeze-frame capture of fast-moving parts, plan a stop-station or evaluate a global-shutter alternative.
  • The 1.1 um pixels are very small, so the lens must out-resolve the sensor. Specify high-resolution S-mount (M12) optics matched to the 1/3.2-inch format, and budget for adequate light because tiny pixels collect fewer photons.
  • Mounting and focus are your responsibility: the bare-board variant has no lens holder, and even the S-mount version is a board-level part. The mechanical design must hold the optic in alignment and manage focus, since there is no industrial housing.
  • Power and thermals are coupled to the host. The module is interface-powered at 5 VDC (1.35 W typ.) with a 0 to 75 C operating range, so confirm the carrier board supplies clean 5 V over the CSI link and that the shared enclosure keeps the board within range.

Specifications: General
BrandBasler
Camera typeEmbedded (dart E, area scan)

Specifications: Sensor
Resolution13 MP
Horizontal resolution4208 x 3120 px
Mono / colorColor
Sensor manufactureronsemi
Sensor modelonsemi AR1335
ShutterRolling shutter
Sensor size1/3" (4.63 mm x 3.43 mm)
Pixel size1.1 um x 1.1 um

Specifications: Performance
FPS30 fps

Specifications: Interface
Interfacebcon-mipi (BCON for MIPI / MIPI CSI-2)
ProtocolsGenICam (BCON for MIPI)

Specifications: Optics
MountS-mount or bare board (no mount)

Specifications: Electrical
Powerinterface-powered (5 VDC via BCON for MIPI)
Power consumption1.35 W
Supply voltage5 VDC

Specifications: Environment
Operating temperature0 to 75 °C

Specifications: Mechanical
Dimensions5.3 x 27 x 27 mm
Weight5 g

Frequently asked questions

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