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Omron / Sentech 3Z4S-LE VS-TCH1-110-O machine vision lens
  • Rosepetal compatible
  • Recommended by AIS Vision

Omron / Sentech VS-TCH1-110-O High-Resolution Telecentric Lens

3Z4S-LE VS-TCH1-110-O

The Omron 3Z4S-LE VS-TCH1-110-O is a straight-body, high-resolution telecentric lens designed for megapixel C-mount machine vision cameras, offering 1.0x (±5%) optical magnification at a working distance of 110.3 mm. It delivers 6.99 µm resolution (at 550 nm), a depth of field of 0.84 mm, and extremely low TV distortion of 0.02%, making it well-suited for precision dimensional measurement and alignment. The lens supports up to a 2/3-inch sensor with a field of view of 6.6 × 8.8 mm and 99% relative illuminance at full field. At Ø30 mm × 129 mm and 92 g, it is compact and practical for integration in automated inspection systems.

Brand
Omron / Sentech
Lens mount
C-mount
Telecentric
Yes
Magnification
1.0x (±5%)
Working distance
110.3 mm
Aperture (f-number)
F10.49
Image circle / max sensor
2/3 inch (max sensor)
Dimensions
Ø30 (max) × 129.0 mm
Weight
92 g

Technical overview

The Omron VS-TCH1-110-O is an object-space telecentric lens operating at exactly 1.0x magnification (±5%), which means every point in the object plane is imaged at unit scale regardless of minor axial shifts within the depth of field. This telecentric geometry eliminates the perspective error that plagues conventional lenses when measuring parts at slightly different heights — a critical property when inspecting machined components, semiconductor packages, or pharmaceutical tablets whose surfaces are never perfectly coplanar. At a fixed 110.3 mm working distance, the lens imposes an object-space field of view of 6.6 × 8.8 mm when paired with cameras using up to a 2/3-inch sensor. Installers should note that the working distance is fixed by design: unlike a standard macro lens, there is no focusing ring that trades off magnification against distance. The part must arrive repeatably at 110.3 mm from the front of the lens barrel.

Resolution is specified at 6.99 µm (at 550 nm wavelength), which sets the finest feature the optical system can resolve before the sensor pixel pitch becomes the limiting factor. On a megapixel camera with a 2/3-inch sensor, the lens resolves features on the object down to roughly 7 µm — suitable for detecting edge chips on silicon dies, ink-jet dot placement, fine lead-pitch solder, or printed character strokes. The F10.49 fixed aperture delivers a depth of field of 0.84 mm, narrow enough to reject background clutter yet wide enough to tolerate the small height variation present in most precision parts. TV distortion is rated at 0.02%, which at an 8.8 mm field translates to a worst-case positional error of under 2 µm across the full image — essential for dimensional measurement where sub-pixel accuracy is expected. Relative illuminance at full field is 99%, meaning brightness falloff from center to corner is negligible, allowing threshold-based edge detection and binarization to perform consistently across the entire field without flat-field correction.

At Ø30 mm × 129 mm and 92 g, the lens body is compact enough to mount directly on a standard C-mount camera without additional support brackets in most orientations, simplifying mechanical integration. The straight-body form factor is particularly convenient in gantry or inline fixtures where a coaxial or ring illuminator must be placed around the lens barrel. Because telecentric lenses require a front aperture at least as wide as the magnified pupil, installers planning coaxial illumination should verify that their beam-splitter cube fits within the 110.3 mm working distance budget. Diffuse on-axis or dome illumination is generally preferred for reflective metallic surfaces; structured or directional side lighting can be added to highlight surface relief, but the telecentric geometry will still interpret any height variation within the 0.84 mm DoF as being in focus.

Best for

  • Precision dimensional gauging of small machined parts, stamped metal components, or molded plastic features where height variation of up to 0.84 mm must not introduce magnification error
  • Semiconductor and electronics inspection — die attach positioning, BGA pad layout verification, fine-pitch lead inspection — where a 6.6 × 8.8 mm field of view covers a single component or small panel region with sub-pixel geometric accuracy
  • Pharmaceutical tablet and capsule measurement for diameter, coating uniformity, and print legibility, where consistent unit-magnification across the full tablet face is required for regulatory traceability
  • OCR/OCV on small labels, direct part marks (DPM), or engraved part numbers where 0.02% TV distortion ensures character geometry is not distorted and recognition algorithms see undistorted strokes
  • Wafer or glass substrate edge-chip detection in semiconductor and display manufacturing, where the flat, high-uniformity illumination field (99% relative illuminance) enables reliable binarization to find micron-scale defects

Selection notes

  • The working distance is fixed at 110.3 mm — there is no adjustment. Your mechanical fixture must position the part at exactly this distance from the lens front. Verify that your conveyor, pallet, or pick-and-place system can hold that tolerance, and leave clearance in the machine envelope for the 129 mm body length behind the C-mount face.
  • The image circle covers a maximum 2/3-inch sensor. Mounting this lens on a camera with a larger sensor (e.g., 1-inch or 4/3-inch) will introduce vignetting in the corners. For best uniformity, select a camera whose sensor is 2/3-inch or smaller.
  • The F10.49 aperture is fixed and cannot be adjusted. This limits light throughput compared to lower F-number lenses. Under typical LED illumination, you will need either a high-luminance ring or dome light, a high-sensitivity camera, or a strobe controller to achieve adequate exposure at production line speeds. Budget for adequate illumination intensity before finalizing integration.
  • At 1.0x magnification, every micrometer of object feature maps to one micrometer on the sensor. The effective system resolution is therefore determined by whichever is coarser: the lens optical resolution (6.99 µm) or the camera pixel pitch. To avoid the camera pixel pitch becoming the resolution bottleneck, select a camera with a pixel pitch at or below approximately 7 µm, consistent with the lens's specified optical resolution.
  • TV distortion of 0.02% is extremely low but not zero. For the most demanding metrology applications (sub-micron tolerances), a per-unit distortion calibration step using a calibration grid is recommended, particularly if the camera's pixel array flatness or lens-to-sensor alignment introduces additional systematic error.

Specifications: General
BrandOmron / Sentech

Specifications: Optical
Lens mountC-mount
TelecentricYes
Magnification1.0x (±5%)
Working distance110.3 mm
Aperture (f-number)F10.49
Image circle / max sensor2/3 inch (max sensor)

Specifications: Mechanical
DimensionsØ30 (max) × 129.0 mm
Weight92 g

Frequently asked questions

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