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Omron / Sentech 3Z4S-LE VS-TCH1-110CO-O machine vision lens
  • Rosepetal compatible
  • Recommended by AIS Vision

VS-TCH1-110CO-O High-Resolution Telecentric Lens

3Z4S-LE VS-TCH1-110CO-O

The VS-TCH1-110CO-O is a fixed-magnification (1.0x ±5%) bi-telecentric lens from Omron's VS-TCH high-resolution series, offering a 110.3 mm working distance with a built-in coaxial prism for co-axial illumination. It achieves a numerical aperture of 0.048 (working F/10.5), 0.8 mm depth of field, and an extremely low TV distortion of 0.02% on a 2/3" sensor, making it suitable for high-precision dimensional measurement and alignment. The C-mount interface with a 17.526 mm flange-back distance is compatible with standard machine-vision cameras up to 2/3" format, delivering a 8.4 × 7.1 mm field of view on that sensor size. Physical footprint is compact at φ30 × 129 mm, with a filter thread of M27 P=0.5 and approximate weight of 96 g.

Brand
VS-Technology (sold by Omron as OEM)
Lens mount
C-Mount
Magnification
1.0x
Working distance
110.3 mm
Aperture (f-number)
F10.49
Image circle / max sensor
2/3" (8.8 mm diagonal)
Telecentric
Yes
Optical resolution
2 MP
Weight
96 g
Dimensions
φ30 mm (max.) × L=129 mm

Technical overview

The VS-TCH1-110CO-O is a fixed-magnification bi-telecentric lens operating at a true 1.0x (±5%) magnification ratio, which means one pixel on the sensor corresponds to one pixel of real-world feature size across the entire 8.4 × 7.1 mm field on a 2/3" sensor. Telecentricity in both the object and image spaces eliminates the perspective error that causes conventional lenses to report a slightly different diameter for a raised feature versus a recessed one — a critical property whenever the installation cannot guarantee that every part arrives at exactly the same standoff height. At 110.3 mm working distance the lens provides enough clearance for most in-line gauging fixtures, robot-end-effector mounts, or conveyor-edge setups, while the compact ø30 × 129 mm body and 96 g mass keep cantilever stress on the camera low. The C-mount flange-back of 17.526 mm is standard, so no adapter ring is required for any C-mount industrial camera up to 2/3" format.

The optical design delivers TV distortion of just 0.02%, which is among the lowest values achievable at this price tier. In practical terms, on a 2/3" sensor a 0.02% distortion figure means a feature at the edge of the field is displaced by below 1 µm — effectively negligible relative to any real pixel pitch at 2 MP or above. Working aperture is F/10.5 (NA 0.048), yielding a depth of field of 0.8 mm. That 0.8 mm DOF demands careful z-axis fixturing; it also means the system is unforgiving of part tilt or vibration, so rigid mounting and stable transport are prerequisites. The built-in coaxial prism port is the defining feature of this particular variant: it accepts a coaxial illuminator that injects light along the optical axis and reflects it toward the object, then allows return light to pass straight through to the sensor. This geometry produces a bright, shadow-free, mirror-like reflection off flat specular surfaces — ideal for reading laser-marked or dot-peened codes on polished metal and for detecting micro-scratches that scatter the coaxial beam differently than the surrounding surface.

For camera pairing, any C-mount sensor up to 2/3" is mechanically compatible, but the lens is specified for up to 2 MP optical resolution, so pairing it with a sensor denser than roughly 1600 × 1200 pixels at 2/3" format may not yield additional spatial detail — choose a camera whose pixel pitch at that format is at or above the diffraction limit at F/10.5. The M27 P=0.5 filter thread accepts standard 27 mm optical filters; a bandpass filter matched to the coaxial illuminator's wavelength is a common addition to reject ambient light on factory floors. Because magnification is fixed, field of view is determined solely by sensor size: 8.4 × 7.1 mm on 2/3". Engineers sizing the system should confirm that the largest expected part feature spans no more than roughly 8 mm, or plan a multi-shot tiling strategy.

Best for

  • High-precision dimensional gauging of machined or stamped parts where feature heights vary by up to ±0.4 mm (within the 0.8 mm depth of field) and sub-pixel measurement accuracy is required — the 0.02% distortion and 1.0x magnification make sub-micron per-pixel calibration traceable and stable.
  • Reading laser-marked DataMatrix or 2D codes on polished or brushed metal surfaces (electronics, automotive, medical implants) where ring or dome lighting creates specular hot-spots — the integrated coaxial prism port delivers uniform on-axis illumination that maximises contrast on these low-relief marks.
  • Wafer-level or PCB component alignment and placement verification in semiconductor and electronics assembly, where parallel ray geometry ensures that positional readings are independent of component thickness variation across the carrier.
  • Surface micro-defect detection on flat reflective targets such as glass, ceramic, or mirror-finished metal where coaxial illumination reveals pits, scratches, and inclusions as dark features against a uniform bright background.
  • Medical device and pharmaceutical blister-pack inspection requiring traceable dimensional data with minimal lens-induced measurement error, especially in regulated environments where the 0.02% distortion figure can be cited directly in system validation documentation.

Selection notes

  • Depth of field is only 0.8 mm — fixtures and part presentation must hold z-axis variation within ±0.4 mm of the nominal working distance of 110.3 mm; free-resting or vibrating parts will produce out-of-focus images that invalidate measurements.
  • The coaxial prism port is only useful when paired with a compatible coaxial illuminator; the illuminator is not included and must be specified separately — confirm beam size, wavelength, and port diameter compatibility before ordering. A bandpass filter on the M27 P=0.5 filter thread is strongly recommended to suppress ambient and ring-light contamination.
  • Camera sensor format must not exceed 2/3" (8.8 mm diagonal) — using a larger sensor will vignette the corners and introduce uncalibrated edge distortion. Pixel pitch should ideally be 3.45 µm or coarser to stay within the diffraction-limited resolution at F/10.5.
  • Magnification is fixed at 1.0x with no focus or zoom adjustment; the field of view is entirely determined by sensor size (8.4 × 7.1 mm on 2/3"). If the inspection window needs to change, a different sensor format or a different lens from the VS-TCH series must be selected — there is no in-field adjustment.
  • The 129 mm body length combined with the 110.3 mm working distance places the part approximately 239 mm from the lens flange; verify this clearance envelope is available in the machine frame, especially in gantry or pick-and-place installations.

Specifications: General
BrandVS-Technology (sold by Omron as OEM)

Specifications: Optical
Lens mountC-Mount
Magnification1.0x
Working distance110.3 mm
Aperture (f-number)F10.49
Image circle / max sensor2/3" (8.8 mm diagonal)
TelecentricYes
Optical resolution2 MP

Specifications: Mechanical
Weight96 g
Dimensionsφ30 mm (max.) × L=129 mm

Frequently asked questions

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