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Omron / Sentech 3Z4S-LE VS-TCH2-110CO-O machine vision lens
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  • Recommended by AIS Vision

Omron / Sentech VS-TCH2-110CO-O High-Resolution Telecentric Lens

3Z4S-LE VS-TCH2-110CO-O

The VS-TCH2-110CO-O is part of Omron's 3Z4S-LE VS-TCH Series of high-resolution telecentric lenses for C-mount cameras. It delivers 2.0x magnification at a 110.8 mm working distance with an effective F-number of 13.5, 0.27 mm depth of field, and 4.53 μm optical resolution at 550 nm. The coaxial prism design accommodates coaxial illumination for shadow-free imaging of reflective surfaces. TV distortion is specified at a maximum of 0.03%, making it well-suited for dimensional measurement and precision alignment applications.

Brand
Omron / Sentech
Lens mount
C-Mount
Magnification
2.0x
Working distance
110.8 mm (±3.3 mm)
Aperture (f-number)
F/13.5 (effective)
Image circle / max sensor
2/3 inch (max)
Telecentric
Yes
Focal length
Not specified (telecentric design)
Weight
110 g
Operating temperature
0 to 50°C

Technical overview

The Omron VS-TCH2-110CO-O is a fixed-magnification telecentric lens operating at exactly 2.0x, designed for C-mount megapixel cameras with sensors up to the 2/3-inch format. Telecentricity is the defining optical property here: unlike conventional lenses, the chief ray exits the lens parallel to the optical axis, which means the apparent size of an object does not change with small depth variations. This makes the lens fundamentally different from entocentric alternatives for any application where a measured dimension must be independent of part height variation or focus drift. The TV distortion figure of 0.03% maximum is consistent with sub-pixel dimensional measurement at 2.0x magnification, enabling reliable gauging of precision-machined parts, connector pins, or pharmaceutical tablet profiles.

The coaxial prism design built into the lens body is the other distinguishing feature. Coaxial illumination — where light travels along the same axis as the imaging path — produces near-specular, shadow-free images of flat or mirror-like surfaces: bare silicon dies, polished metal lands, solder pads, and glass substrates that scatter or absorb oblique ring-light poorly. Because the coaxial port is integrated rather than added externally, the working distance of 110.8 mm (±3.3 mm tolerance) is fixed by the optic itself and must be respected at installation; there is no focus adjustment to compensate for changes in object distance outside that tolerance. The effective aperture of F/13.5 and the resulting 0.27 mm depth of field are direct consequences of telecentric design at 2.0x — installers should account for part height variation falling within that depth budget or plan for axial stages. Optical resolution is quoted at 4.53 µm at 550 nm wavelength, so pixel pitch on the chosen sensor should be at or below roughly 4–5 µm to fully exploit the lens's resolving capability without wasting optical performance.

The lens mounts directly to any C-mount camera body and covers sensors up to 2/3 inch, covering the most common high-resolution area-scan formats used in precision inspection. At 110 g the lens is mechanically modest and integrates without excessive cantilever stress on camera PCB connectors. The operating temperature range of 0–50°C is standard industrial range. Because the working distance is non-adjustable, system integrators must dimension mounting fixtures with precision: the 110.8 mm standoff from the front element to the object plane is the only valid working position, and any compliance in the fixture will erode measurement repeatability. Coaxial light source selection should prioritize narrow-spectrum illumination near 550 nm to match the specified optical resolution wavelength, though the coaxial port can accept broadband sources where color discrimination is not needed.

Best for

  • Dimensional gauging of precision-machined or stamped metal parts where sub-pixel accuracy is required and part height variation must not introduce magnification error — telecentricity directly eliminates perspective error that would otherwise corrupt edge-detection-based measurements.
  • Semiconductor and electronics inspection of flat reflective surfaces such as bare die, bond pads, BGA lands, and PCB solder joints, where the integrated coaxial illumination port produces shadow-free, high-contrast images that oblique or ring lighting cannot achieve on specular targets.
  • Pharmaceutical tablet and capsule dimensional verification on conveyored lines, where consistent 2.0x magnification and low distortion enable reliable pass/fail decisions on diameter, thickness, and edge profile without per-part recalibration.
  • Precision alignment and robot guidance tasks requiring a known, repeatable magnification factor so that pixel-to-millimeter calibration remains stable over time and across units, reducing inline calibration overhead.
  • Connector and fine-pitch component inspection in electronics assembly where the coaxial illumination reveals surface-height discontinuities and co-planarity defects on reflective leads or terminals that would otherwise produce glare artifacts under directional lighting.

Selection notes

  • The 110.8 mm working distance is fixed and non-adjustable — design the fixture or gantry to hold this standoff precisely. Even small deviations will shift the object plane outside the 0.27 mm depth of field and degrade resolution to below the 4.53 µm specification, which will manifest as blurred edges and poor measurement repeatability.
  • Sensor format must not exceed 2/3 inch. Mounting this lens on a camera with a larger sensor will produce darkened corners and invalid measurements outside the specified image circle — verify sensor size of the target camera before specifying.
  • The F/13.5 effective aperture limits light throughput compared to lower-f-number entocentric lenses. Coaxial illuminators must provide sufficient radiance to achieve the exposure times compatible with line speed; strobed high-intensity coaxial sources are typically preferred over continuous low-power LEDs for moving parts.
  • Pixel pitch on the mated camera should ideally be 4–5 µm or smaller to avoid undersampling the 4.53 µm optical resolution limit. Using a sensor with coarser pixels wastes the lens's resolving capability and limits the minimum detectable feature size, while much finer pixels provide no additional sharpness benefit given the optical resolution floor.
  • The 0.03% TV distortion specification applies at the rated working distance and for sensors within the 2/3-inch image circle. Any field-flattening or calibration routine in the vision software should use a certified calibration target measured at the exact working distance to validate this distortion baseline before going into production measurement mode.

Specifications: General
BrandOmron / Sentech

Specifications: Optical
Lens mountC-Mount
Magnification2.0x
Working distance110.8 mm (±3.3 mm)
Aperture (f-number)F/13.5 (effective)
Image circle / max sensor2/3 inch (max)
TelecentricYes
Focal lengthNot specified (telecentric design)

Specifications: Environment
Operating temperature0 to 50°C

Specifications: Mechanical
Weight110 g

Frequently asked questions

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