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Basler boA8100-16cm machine vision camera
BaslerHigh-resolution cameras
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Basler boost boA8100-16cm

boA8100-16cm

The Basler boost boA8100-16cm is a high-resolution monochrome area scan camera based on the onsemi XGS 45000 CMOS sensor (Super 35 mm format, 3.2 µm pixel pitch) with a global shutter. It uses the CoaXPress 2.0 interface at up to 12.5 Gbps per link (single-link CXP-12), achieving 19 fps at full 44.7 MP resolution. Power is supplied via PoCXP or 24 VDC, and the camera is compliant with GenICam, CoaXPress 2.0, CE, FCC, and UL standards. Available lens mounts include F-mount, M42 × 0.75, and M42 × 1; the housing measures 49.1 × 80 × 80 mm and weighs approximately 525 g.

Brand
Basler
Camera type
Area Scan
Interface
CoaXPress 2.0 CXP-12 (2.5–12.5 Gbps, 1 link)
Resolution
44.7 MP
Horizontal resolution
8192 × 5460 px
Mono / color
Monochrome
Sensor manufacturer
onsemi
Sensor model
onsemi XGS 45000
Shutter
Global Shutter
FPS
19 fps (max, full resolution)
Mount
F-mount, M42 × 0.75, M42 × 1
Sensor size
Super 35 mm (26.2 × 17.4 mm)
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Technical overview

The boA8100-16cm is built around the onsemi XGS 45000, a Super 35 mm format CMOS sensor measuring 26.2 × 17.4 mm with a 31.5 mm diagonal. At 3.2 µm pixel pitch across an 8192 × 5460 array, the camera delivers 44.7 MP of genuine resolving power — enough to cover a 300 mm-wide part at better than 35 µm/pixel from a fixed single station, or to support sub-pixel measurement on small features without a second camera pass. The global shutter ensures every pixel integrates simultaneously, so fast-moving parts, rotating components, or conveyor lines captured under strobe illumination produce geometrically undistorted images — a non-negotiable property for dimensional gauging and any application where feature position must be accurate rather than merely sharp.

The CoaXPress 2.0 interface operates over a single coax cable at up to 12.5 Gbps (CXP-12), sustaining 19 fps at the full 44.7 MP resolution. The interface carries image data and camera control over a single coax, and when the frame grabber supports PoCXP, power is delivered over the same cable as well — simplifying cable routing in cramped machine enclosures. Alternatively, a 24 VDC supply in the 18.6–26 VDC range can be used via the camera's dedicated power connector. The 8.6 W power draw is modest for a sensor of this class. The camera conforms to GenICam, making it plug-compatible with Basler pylon, Cognex VisionPro, MVTec HALCON, and any other GenICam-compliant acquisition layer without custom drivers. Lens mount options — F-mount, M42 × 0.75, and M42 × 1 — give integrators access to the full range of high-coverage large-format optics needed to fill a 31.5 mm image circle without vignetting.

For installation planning, the Super 35 mm image circle constrains lens selection: only optics rated for at least the 31.5 mm sensor diagonal will cover the sensor corner-to-corner without vignetting. F-mount lenses with large rear elements (e.g., Schneider, Rodenstock, and Fujinon large-format lines) are appropriate. Lighting and trigger pairing should use strobe flash to fully exploit the global shutter — continuous illumination works but forces longer exposure times that can reduce contrast on moving parts. The 0–50 °C operating range covers typical factory-floor environments, and the 49.1 × 80 × 80 mm housing fits standard 80 mm lens-column brackets. At 525 g, the camera is light enough for gantry or robotic-arm mounting without requiring a counterweight redesign.

Best for

  • Large-area surface inspection where a single high-resolution frame must capture the entire part — flat panel substrates, battery electrode sheets, metal strip, or wide printed labels — without stitching multiple lower-resolution images.
  • Precision dimensional measurement of medium-to-large components (100–400 mm field) where 3.2 µm pixels, a global shutter, and a stable 26.2 × 17.4 mm sensor area combine to achieve sub-pixel gauging accuracy.
  • High-throughput packaging and pharmaceutical label verification that requires simultaneous code reading, OCR, and cosmetic inspection in a single acquisition, exploiting the full 44.7 MP to resolve fine print alongside larger features without ROI compromise.
  • Semiconductor and electronics panel inspection — PCB bare-board, wafer-level packaging, or display glass — where monochrome sensitivity and fine pixel pitch deliver contrast on traces and solder pads at production-relevant frame rates.
  • Automotive and battery cell traceability lines where a single overhead camera must read a 2D data matrix, verify a label, and confirm part orientation in one frame at line speed up to 19 fps.

Selection notes

  • Lens image-circle coverage is the most common design-in pitfall: any lens mounted to this camera must cover at least the 31.5 mm diagonal of the Super 35 mm sensor. Standard APS-C or 4/3 lenses will produce heavy corner vignetting. Verify the lens datasheet explicitly states Super 35 mm or larger image-circle coverage.
  • A CXP-12 frame grabber is required — the camera does not operate over GigE or USB3. Budget for a single-link CXP-12 frame grabber (e.g., Basler CXP-12 Interface Card 1C) and confirm PCIe bandwidth on the host PC, since 44.7 MP at 19 fps generates substantial raw pixel data. Benchmark acquisition and processing throughput at the target resolution before committing to a cycle-time budget.
  • PoCXP simplifies wiring: a single 75-ohm coax (RG-6 or equivalent, rated for the CoaXPress 2.0 standard) can carry power, data, and trigger when the frame grabber supports PoCXP. Confirm cable quality and bend-radius constraints at installation — low-quality coax or tight bends degrade signal integrity at 12.5 Gbps and can force link negotiation down to a lower speed tier.
  • The global shutter makes the camera well-suited to strobe illumination, but also compatible with continuous LED illumination for slower or stationary parts. If strobing, match the strobe controller's minimum pulse width to the camera's minimum exposure time; validate that the lighting supplier supports trigger input at the frame rate used.
  • At 44.7 MP per frame, storage and processing throughput demands are substantial. Confirm that the vision PC has enough RAM for the acquisition buffer, that the storage subsystem (NVMe RAID or equivalent) can sustain write throughput if logging images, and that the image-processing library (HALCON, OpenCV, pylon SDK) is benchmarked at this resolution before committing to a cycle-time budget.

Specifications: General
BrandBasler
Camera typeArea Scan

Specifications: Sensor
Resolution44.7 MP
Horizontal resolution8192 × 5460 px
Mono / colorMonochrome
Sensor manufactureronsemi
Sensor modelonsemi XGS 45000
ShutterGlobal Shutter
Sensor sizeSuper 35 mm (26.2 × 17.4 mm)
Pixel size3.2 × 3.2 µm

Specifications: Performance
FPS19 fps (max, full resolution)

Specifications: Interface
InterfaceCoaXPress 2.0 CXP-12 (2.5–12.5 Gbps, 1 link)
ProtocolsGenICam, CoaXPress 2.0

Specifications: Optics
MountF-mount, M42 × 0.75, M42 × 1

Specifications: Electrical
PowerPoCXP or 24 VDC (18.6–26 VDC)
Power consumption8.6 W

Specifications: Environment
Operating temperature0–50 °C

Specifications: Mechanical
Dimensions49.1 × 80 × 80 mm
Weight525 g

Frequently asked questions

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