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iRAYPLE AX5F57MG250E / AX5F57CG250E (9344x7000, 1.7fps, GMAX3265, GigE, ~65MP) machine vision camera
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  • Recommended by AIS Vision

iRAYPLE AX5F57MG250E / AX5F57CG250E 65MP GigE Large Area Scan Camera

AX5F57MG250E

The iRAYPLE AX5F57MG250E/CG250E is a 65 MP large-format area scan camera using the Gpixel GMAX3265 global shutter CMOS sensor with 9344x7000 resolution and 3.2 µm pixel pitch, delivering an optical format of approximately 2.3". It connects via GigE Vision V2.0 compliant Gigabit Ethernet (up to 100 m), supports GenICam, and runs at 1.7 fps at full resolution with a 512 MB on-board image buffer. The camera provides 8.4 W power consumption on DC 24V via a 12-pin Hirose connector, opto-coupled I/O (3 in / 3 out), and an M58x0.75 lens mount, housed in a compact 72x72x69.8 mm body weighing 482 g.

Brand
iRAYPLE
Camera type
Area Scan
Interface
GigE (GigE Vision V2.0)
Resolution
~65 MP
Horizontal resolution
9344 px (H) × 7000 px (V)
Mono / color
Mono (AX5F57MG250E) / Color (AX5F57CG250E)
Sensor manufacturer
Gpixel
Sensor model
Gpixel GMAX3265
Shutter
Global Shutter
FPS
1.7 fps
Mount
M58 × 0.75
Sensor size
~2.3" (29.9 mm × 22.4 mm)

Technical overview

The iRAYPLE AX5F57MG250E is built around the Gpixel GMAX3265 global shutter CMOS sensor, delivering 65.4 MP across a 9344 x 7000 pixel array with 3.2 µm pixel pitch on an approximately 2.3" (29.9 mm x 22.4 mm) optical format. The global shutter eliminates the motion artifacts and geometric distortion that plague rolling-shutter designs, which matters enormously when parts are moving on a conveyor or when a strobe flash captures a brief moment in a dynamic process. At 3.2 µm per pixel, the sensor is fine-grained enough to resolve sub-millimetre features across a very wide field of view — a combination that is difficult to achieve with smaller-format sensors without resorting to mosaicing or complex multi-camera rigs. The -30 °C to +50 °C operating range means the camera can be deployed in cold-chain packaging halls or warm semiconductor fabs without thermal conditioning enclosures.

The camera connects over GigE Vision V2.0 compliant Gigabit Ethernet, supporting GenICam for software-agnostic integration with any major vision framework. The 100 m cable reach is a practical advantage in large-format inspection cells where the host PC must be housed in a clean cabinet away from the inspection zone. At full 65 MP resolution the camera outputs 1.7 fps, and a 512 MB on-board frame buffer absorbs burst captures so that network jitter does not cause frame drops. Trigger and synchronisation are handled through three opto-coupled inputs and three opto-coupled outputs on the 12-pin Hirose connector, which also carries DC 24 V power at 8.4 W — allowing a single cable run for power and I/O in many installations. The M58 x 0.75 lens mount is the industrial standard for large-format machine vision optics, giving access to a wide range of telecentric, low-distortion, and high-resolution lenses designed to cover image circles beyond 2".

The 72 x 72 x 69.8 mm body and 482 g mass make this a compact package for a 65 MP sensor — it can be integrated into tight fixture designs or multi-camera arrays without excessive mechanical overhead. The monochrome variant (AX5F57MG250E) maximises spatial resolution and sensitivity by avoiding the Bayer demosaicing interpolation of the colour model, which is the preferred choice whenever texture, edge sharpness, or greyscale contrast is the primary discriminant. The colour variant (AX5F57CG250E) trades a small amount of effective resolution for chromatic discrimination, useful in applications where colour coding, printed labelling, or material differentiation must be assessed alongside dimensional or defect data. Both variants share the same electrical, mechanical, and protocol specification, so they can be swapped within a validated fixture design if inspection requirements evolve.

Best for

  • Large-panel surface inspection — the 9344 x 7000 pixel array covers a wide field at fine pitch, enabling detection of micro-scratches, pinholes, and coating defects across large substrates (glass, battery electrodes, flexible electronics) in a single capture rather than multiple stitched frames.
  • High-accuracy dimensional gauging of large components — the global shutter freezes geometry without distortion, and the 2.3" sensor format supports large-image-circle low-distortion M58 optics, making sub-pixel metrology reliable across the full field.
  • Semiconductor wafer and flat-panel substrate inspection — the monochrome variant's high pixel count and global shutter suit the fine-feature, high-contrast imaging requirements of wafer macro inspection and panel alignment verification in fab environments.
  • Pharmaceutical and packaging print inspection (OCR/OCV and label verification) — 65 MP spread over a wide label or blister-pack field resolves small fonts and 2D codes at distances that keep the camera outside contamination zones, aided by the long GigE cable reach.
  • Automotive body and stamped-part inspection — the -30 °C to +50 °C operating envelope and opto-coupled I/O make the camera robust in paint-shop and press-line environments where electrical noise and temperature swings are common.

Selection notes

  • Lens selection is critical at this resolution: the M58 x 0.75 mount requires a lens with an image circle of at least 38 mm (to cover the 29.9 x 22.4 mm sensor diagonal of ~37.4 mm) and sufficient resolving power to exploit 3.2 µm pixels — check the lens MTF at the sensor corners, not just the centre, before committing to an optic.
  • GigE at 1.7 fps full-resolution is throughput-limited for continuous-motion inspection; verify that your line speed allows the part to be stationary or nearly stationary during exposure, or that strobe duration is short enough to freeze motion independently of the frame rate. The 512 MB on-board buffer helps absorb burst sequences but does not increase sustained throughput beyond 1.7 fps.
  • The 3.2 µm pixel pitch requires careful focus and vibration isolation — at high magnification, mechanical vibration of even a few microns will degrade resolution below what the sensor is capable of. Mount rigidity and focus locking are more important here than with coarser-pixel cameras.
  • Power is supplied at DC 24 V via the Hirose 12-pin connector at 8.4 W; ensure your 24 V rail is adequately decoupled and rated for inrush, especially in multi-camera arrays. No Power over Ethernet (PoE) is available — a separate 24 V cable run is always required alongside the GigE data cable.
  • Choose the monochrome variant (AX5F57MG250E) for pure defect and dimensional tasks where greyscale contrast and maximum spatial resolution matter; choose the colour variant (AX5F57CG250E) only when chromatic discrimination is an explicit inspection requirement, accepting that Bayer interpolation slightly reduces effective spatial resolution compared to the mono sensor.

Specifications: General
BrandiRAYPLE
Camera typeArea Scan

Specifications: Sensor
Resolution~65 MP
Horizontal resolution9344 px (H) × 7000 px (V)
Mono / colorMono (AX5F57MG250E) / Color (AX5F57CG250E)
Sensor manufacturerGpixel
Sensor modelGpixel GMAX3265
ShutterGlobal Shutter
Sensor size~2.3" (29.9 mm × 22.4 mm)
Pixel size3.2 µm × 3.2 µm

Specifications: Performance
FPS1.7 fps

Specifications: Interface
InterfaceGigE (GigE Vision V2.0)
ProtocolsGigE Vision V2.0, GenICam

Specifications: Optics
MountM58 × 0.75

Specifications: Electrical
PowerDC 24V via Hirose 12-pin
Power consumption8.4 W

Specifications: Environment
Operating temperature-30 °C ~ +50 °C

Specifications: Mechanical
Dimensions72 × 72 × 69.8 mm
Weight482 g

Frequently asked questions

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