Skip to content
Basler daA1600-60um machine vision camera
  • Rosepetal compatible
  • Recommended by AIS Vision

Basler dart Classic daA1600-60um

daA1600-60um

The Basler daA1600-60um is a compact board-level camera in the dart Classic family, featuring a 1/1.8" e2V EV76C570 CMOS global shutter sensor at 1600x1200 (2 MP) resolution running at up to 60 fps. It connects via USB 3.0 (5 Gbit/s SuperSpeed) using a Micro-B connector, which also supplies 5 VDC power at 1.3 W typical consumption. The camera outputs 8-bit or 12-bit monochrome pixel data and is compliant with USB3 Vision and GenICam 2.x protocols. It is available in no-mount (bare board), S-mount, and CS-mount variants, with dimensions ranging from 7.2x27x27 mm (bare board) to 19.9x29.3x29 mm (with housing).

Brand
Basler
Camera type
Area Scan
Interface
USB 3.0 (5 Gbit/s SuperSpeed)
Resolution
2 MP
Horizontal resolution
1600 (horizontal); 1200 is the vertical resolution
Mono / color
Monochrome
Sensor manufacturer
e2v (brand as used by Basler); corporate entity is Teledyne e2v
Sensor model
e2V EV76C570
Shutter
Global Shutter
FPS
60 fps
Mount
CS-mount / S-mount / No-mount (board level)
Sensor size
1/1.8" (7.2 x 5.4 mm, 9 mm diagonal)

Technical overview

The Basler daA1600-60um is built around the e2V EV76C570 CMOS sensor in a 1/1.8" optical format (7.2 x 5.4 mm active area, 9 mm diagonal), delivering 1600 x 1200 pixels at a 4.5 x 4.5 µm pixel pitch. Global shutter capture — where every pixel integrates simultaneously — means there is no geometric distortion of moving objects and no rolling-shutter skew to compensate for, which matters greatly on conveyor-fed inspection lines or any station where parts or the camera itself are in motion at trigger time. At full resolution the sensor runs at 60 fps, giving an installer sufficient frame rate budget to oversample the trigger window, implement multi-frame averaging for noise reduction, or accept a moderate ROI reduction to push throughput higher without switching to a faster, more expensive camera.

The interface is USB 3.0 SuperSpeed (5 Gbit/s) via a Micro-B connector, which simultaneously carries the 5 VDC / 1.3 W bus power the camera draws — no separate power cable is required. Protocol compliance with USB3 Vision and GenICam 2.x means the camera integrates without vendor-specific drivers into any conformant frame grabber software or vision SDK, including Basler's own pylon runtime and third-party platforms. Pixel depth is selectable between 8-bit and 12-bit monochrome, so integrators can trade raw throughput for radiometric depth depending on whether the application needs the full 4096-level dynamic range — useful for diffuse-illumination surface grading — or the leaner 8-bit stream better suited to high-speed code reading. The camera is available in three mount configurations: bare board (7.2 x 27 x 27 mm), S-mount, and CS-mount, with the housing variant measuring 19.9 x 29.3 x 29 mm at 15 g.

The operating temperature range of 0 to 75 °C suits standard industrial enclosures without active cooling. The CS-mount and S-mount variants open the lens library considerably: CS-mount glass covers a wide range of focal lengths optimised for the 1/1.8" format, and S-mount (M12) lenses are common in space-constrained embedded designs. Lighting pairing follows naturally from the monochrome output and global shutter: strobe-synchronised LEDs in any wavelength — white, red, blue, or near-IR — can be fired at the shutter-open moment without ghosting or partial-frame exposure artifacts. For applications requiring depth cues, the global shutter also works cleanly with structured-light projectors and laser-line illuminators that demand precise timing alignment between projector and sensor.

Best for

  • High-speed conveyor inspection of small components — electronics, SMD parts, blister packs — where 60 fps global shutter at 2 MP captures every unit without motion blur at line speeds typical of automated assembly
  • Barcode, QR-code, and DataMatrix reading in logistics sortation or traceability stations, where the monochrome sensor's contrast sensitivity and 12-bit pixel depth resolve low-contrast or damaged codes that colour cameras can obscure
  • Embedded OEM vision modules requiring minimal SWaP (size, weight, and power): the bare-board variant at 27 x 27 mm footprint and 1.3 W bus power fits directly onto a carrier PCB inside medical devices, handheld scanners, or compact robot-mounted heads
  • Robot guidance and pick-and-place applications where global shutter eliminates positional errors caused by rolling-shutter skew when the camera or the conveyor is in motion during exposure
  • Surface and dimensional inspection of flat parts — PCBs, semiconductor wafers, pharmaceutical tablets — where 4.5 µm pixels and a 1/1.8" sensor provide the spatial sampling density needed to detect sub-millimetre defects across a moderate field of view

Selection notes

  • Sensor format and lens compatibility: the 1/1.8" (9 mm diagonal) sensor requires lenses that cover at least this image circle. CS-mount lenses rated for 1/1.8" or larger are directly compatible. S-mount (M12) options should be verified against the manufacturer's image circle specification before finalising a lens choice for this sensor size.
  • USB cable length and latency: USB 3.0 is practically limited to about 3–5 m for reliable 5 Gbit/s operation without an active extension. If the camera must be mounted more than 5 m from the host PC, consider a USB 3.0 active cable or repeater rated for industrial use; standard passive extensions will cause dropped frames at full throughput.
  • Triggering: the daA1600-60um supports hardware triggering via the USB3 Vision trigger interface. External strobe or sensor signals must be routed through the host machine's I/O or a USB3 Vision-compatible I/O breakout — plan the wiring architecture accordingly when integrating into automated line control systems.
  • Bit-depth trade-offs: 8-bit mode maximises USB bandwidth headroom and reduces host-side buffer demands, while 12-bit mode preserves full radiometric information for grading or photometric applications. Confirm your vision software pipeline and frame buffer sizing before locking in pixel format, as 12-bit at 60 fps in unpacked format produces approximately 230 MB/s of raw data.
  • Thermal management in embedded designs: at 1.3 W typical the board generates modest heat, but in a sealed enclosure with limited airflow the operating temperature ceiling of 75 °C can be approached if ambient conditions are high. Provide a thermal path from the sensor PCB to the enclosure wall via a thermal pad or standoff to maintain sensor temperature within the rated window.

Specifications: General
BrandBasler
Camera typeArea Scan

Specifications: Sensor
Resolution2 MP
Horizontal resolution1600 (horizontal); 1200 is the vertical resolution
Mono / colorMonochrome
Sensor manufacturere2v (brand as used by Basler); corporate entity is Teledyne e2v
Sensor modele2V EV76C570
ShutterGlobal Shutter
Sensor size1/1.8" (7.2 x 5.4 mm, 9 mm diagonal)
Pixel size4.5 x 4.5 µm

Specifications: Performance
FPS60 fps

Specifications: Interface
InterfaceUSB 3.0 (5 Gbit/s SuperSpeed)
ProtocolsUSB3 Vision, GenICam 2.x

Specifications: Optics
MountCS-mount / S-mount / No-mount (board level)

Specifications: Electrical
PowerUSB 3.0 bus power, 5 VDC, 1.3 W typical
Power consumption1.3 W
Supply voltage5 VDC

Specifications: Environment
Operating temperature0 to 75 °C

Specifications: Mechanical
Dimensions19.9 x 29.3 x 29 mm
Weight15 g
Housing materialBoard Level

Frequently asked questions

Related technical guides

Rosepetal · AI

Test this camera with Rosepetal

Validate your visual inspection with AI: send us sample images and we evaluate the case on your hardware.

AIS Vision · Integration

We validate camera + lens + lighting

AIS Vision defines and tests the optimal combination of camera, optics and lighting for your application before you buy.